Simplicity TP-1234 Spezifikationen

Issued September 11, 2008 OWNER’S OPERATION AND MAINTENANCE MANUAL OF THE MAK SPUTTERING SOURCES 5830 Hellyer Avenue S

INSTALLATION OF SOURCES STANDARD MOUNTING To mount the source a QUICK COUPLE feedthrough adapter is required. A 0.75” adapter is used for the 1.3”,

7. Slide the End Adapter on the tube, making sure that the slip pin in the connector body is in-serted in the socket of the power feed rod. Pu

POWER HOOK-UP All MAK sputter sources may be operated in either the DC or RF mode. All models are supplied with an HN (Amphenol UG-496/U) for conveni

Input Power Connection 12’ RG-8U Cable with N Type Connections RF Generator D Connector to D Connector 50 Pin Connectors with metal covers Power

TARGET PARAMETERS Purity Target material for the MAK sputtering source is not confined to a minimum or maximum purity level. This parameter is depen

Machinable Materials The target keeper can be attached to machinable materials by drilling and tapping the target to 90% of it’s thickness and attachi

Non-Machinable Materials Ceramic and oxide materials, a copper backing plate containing a magnetic keeper should be used. The target must be bonded t

Copper Backing Plate Specifications (See Appendix A) MAK 1.3” Copper Backing Plate Part Number: MAK-130-BP MAK 2” Copper Backing Plate Part N

RATE VS. POWER COPPER 2" Dia., 3" Dist.0.005.0010.0015.0020.0025.0030.0035.0040.000 50 100 150 200 250 300 350 400 450 500Watts RFÅ/sec When

RELATIVE RATES OF SPUTTERING SOURCES VS DISTANCE Rate data, for sputtering with small sources, is usually taken by making step samples and then measu

Precautions to assure the proper operation of your MAK Source CAUTION • Water MUST be flowing thru the MAK while sputtering. Please see O&M manu

Claims & Returns Shipping and Handling Claims Purchaser should inspect the product carefully as soon as it is received and test it in accordance

Appendix A MAK TECHNICAL SPECIFICATIONS MAK SIZE: MAK 1.3" (33mm) MAK 2" (50.8mm) MAK 3" (76.2mm) MAK 4" (101.6mm) MAK 6&qu

Appendix A MAK TECHNICAL SPECIFICATIONS COOLING MAK 1.3"(33mm) MAK 2" (50.8mm) MAK 3" (76.2mm) MAK 4" (101.6mm) MAK 6"

APPENDIX B TARGET SUPPLIERS ACI Alloys, Inc. 1985 Las Plumas Avenue San Jose, CA 95133 Larry Albert PH: (408) 259-7337 FX: (408) 729-0277 www.acia

Table of Contents Introducing US, a Division of MeiVac, Inc...

INTRODUCING US, a Division of MeiVac, Inc. US has been an innovative manufacturer of sputtering since 1977. Exclusive licenses were ob-tained from St

421.3” MAKUS Part Number DescriptionL130-04 Ceramic Ground ShieldL130-06 Ring MagnetL130-09 Stainless Steel Ground ShieldL130A14 Block AssemblyJ1200-

422.0” MAKUS Part Number DescriptionL200-07 Ring MagnetL200-10 Aluminum Ground ShieldL200A14 Block AssemblyJ1200-06 Center MagnetJ1200-33 O-RingJ1200

423.0” MAKUS Part Number DescriptionL300-10 Aluminum Ground Shield (OLD STYLEMAK SOURCE ONLY)L300-10NT Aluminum Ground ShieldL300-13 Center MagnetL30

424.0” MAKUS Part Number DescriptionL400-10 Aluminum Ground ShieldL400A20 Center Magnet AssemblyL400A14 Block AssemblyJ4600-13 Center MagnetJ4600-32

426.0” MAKUS Part Number DescriptionL600-10 Aluminum Ground ShieldL600-40 O-ring Magnet PlugL600-41 O-RingL600A14 Block AssemblyL600A20 Center Magnet

SIMPLICITY IN SPUTTERING• MAGNETS - NO magnet erosion Cooling Block (Copper)• Water channel 75% of volume, THUS…..• High water flo

MAGNETRON SPUTTERING Observations of the phenomenon we now call sputtering, go back over one hundred years to early experiments which introduced ele

Magnetics No Magnetic Housing• Provides higher magnetic density attarget surface THUS…..– Sputters at lower voltage forcomparable power

Anode• Height adjustable to target thickness -Selectively positioning anode to sameplane of target--- minimizing materialbuild-up Small Profile• Mo

1Simplicity in SputteringINTRODUCINGPlanar MagnetronSputtering SourceThe MAK

2Simplicity in SputteringTarget Installation on the MAKTargetKeeperCathodeMagnets

3Simplicity in Sputtering• Targets mounted by attraction of the center magnet• No mechanical clamping of the target THUS…..• Ease of target change• Ad

4Simplicity in SputteringMAK without target installedTargetKeeperCathodeAdjustableAnode

5Simplicity in SputteringMAK with target installedTargetmountedwithmagnetickeeperAnoderetracted

6Simplicity in SputteringThe MAK with target and anodeAnode adjustedto accommodatethicker targetTargetSlotted anodeallows forvariable targetthickness

7Simplicity in SputteringMAK target installed w/o anodeTarget0.100+ gapbetween targetand magnetsMagnet segments

Copper Backing PlateMAK Backing Plate w/ keeperBacking PlatesCeramics, oxides, and any other non-machinable targets are commonlybonded to a copper bac

In order to increase sputtering rate, magnetic coils were sometimes placed around the chamber to pinch the plasma during the deposition. The pressure

Bonded Target - ExampleThis is an example of a SiO2target bonded to a copperbacking plate with amagnetic keeper attached.target keeperbondcopperbackin

By attaching a magnetic keeper to the target, the MAK source uses themagnetics of the gun to hold the target in place.If you have old targets, NO PROB

RF SPUTTERING If the target is an insulator, the neutralization process results in a positive charge on the target sur-face. This charge may grow to

OPERATION OF THE MAK VACUUM SYSTEMS To successfully operate the MAK Series, a leak-tight vacuum system must be available. This sys-tem should be pump

To obtain ideal uniformity, the distance from source to substrate should be adjustable. Note: The rate will decrease by the square of the dist